Bondexpo, International trade fair for bonding technology

Bondexpo 2026: Your Exclusive Access to the Future of Adhesive Technology

Bondexpo in Stuttgart is much more than just a trade fair – it is the vibrant heart of the international adhesive technology industry. From October 6th to 8th, 2026, leading minds and the most innovative companies will gather here to shape the future of industrial bonding, sealing, foaming, and potting. For developers, designers, and manufacturing specialists from promising sectors such as the automotive and mechanical engineering, electronics manufacturing, or medical technology, Bondexpo is an absolutely essential event. It's a place where not just products are presented, but entire process chains and system solutions that will elevate your production to a new level of efficiency and sustainability. Be there as the course is set for the technological standards of tomorrow and forge valuable connections that will decisively advance your business. Bondexpo is your key to the innovations that will keep you at the forefront of global competition.

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Bondexpo: A Must for Every Industry Insider

Why Bondexpo 2026 in Stuttgart is Your Ultimate Guide in Adhesive Technology

Bondexpo is the international trade fair for adhesive technology. It will take place from October 6th to 8th, 2026, in Stuttgart. The fair is a key meeting point for manufacturers, system providers, and users from a wide variety of industries. From the automotive industry and the electronics sector to medical technology – Bondexpo offers a specialized platform for products, machines, materials, and process solutions. The focus is on efficiency, automation, and sustainable adhesive solutions. At Bondexpo, practical solutions and innovations in industrial bonding, potting, sealing, and foaming are presented. This makes the fair an indispensable event for anyone looking to learn about and discuss the latest trends and developments in adhesive technology.