Bondexpo, International trade fair for bonding technology

The upcoming Bondexpo 2025 at Messe Stuttgart promises to be a major gathering for professionals across the bonding technology and industrial assembly sectors. Scheduled from October 7-9, this trade fair brings together experts, engineers, and leaders from industries such as automotive, electronics, and energy, all eager to explore the latest developments in bonding and fastening technologies. Bondexpo serves as a top-tier platform for showcasing new materials, automation techniques, and innovations in assembly solutions, providing attendees with unique networking and learning opportunities that can drive future success.

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Be inspired by our already realized exhibition stands